This afternoon the team at BondAuction held our first forum, bringing together representatives from the Issuer, Underwriter and Investor community to discuss progress so far and the practical use, implementation and benefits of the platform.
The topics covered included how to handle Minimum Denomination fills for investor bids, appropriate Bid Increments for bid submission and the registration process for each user group.
The interaction and debate was encouraging, underlined by a shared desire to bring positive transformation to the market. Our next forum will be held at the end of April when we will be demonstrating elements of the platform build.
We look forward to an ongoing exchange of ideas with this group and keeping the market informed as to our progress. For further information visit www.bondauction.com or contact us directly via enquiries@bondauction.com