This week BondAuction held the second triparty forum, bringing together representatives from Issuers, underwriters and investors.
We were able to demonstrate working elements of the platform and the process flow for the first time. The ongoing input and feedback from the market participants is helping us challenge every element of the existing bookbuild process and develop a platform delivers maximum benefit for all.
We’d like to take this opportunity to thank them for their continued support in helping redefine the mechanism for primary bond issuance.
If you would like to discuss our plans in more detail, or receive updates please contact us at enquiries@bondauction.com.